Birefringence unevenness inspection of transparent resin molded products

Inspection of transparent resin molded products

Our birefringence measurement products, like PA series, WPA series, including WPA-KAMAKIRI, are widely used for visualization and quantitative evaluation of residual stress distribution, which can cause cracking or degradation of optical performance such as MTF and transmittance degradation.

Internal Stress in Molded Product

Phase difference distribution sensitively reflects differences in molding conditions, making it ideal for process control. Good products (above) and defective products (below) can be compared and quantitatively judged as good or bad.

Visualization of resin flow

During plastic lens molding, when gate distortion extends to the effective diameter, resolving power of the final lens is degraded. Quantitative evaluation enables determination of low distortion molding conditions in a short period of time.

Quality control of processing

Defective drilling of molded products increases residual stress and causes cracks and other defects.
The inspection can be performed in a short time (approx. 1 minute) for quality control of residual stress after processing.

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WPA-300Series

The WPA-300 series provides sharper measurement by increasing the resolution of the polarization image sensor up to 5 times, while maintaining the large phase difference measurement performance of the WPA-200 series.

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It is suitable for quality evaluation of lenses for VR.

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WPA-200Series

WPA series that expands the measurement range of phase difference from 0 to 3,500 nm by measuring the distribution of birefringence/phase difference over three waves.
Suitable for measurement of films and transparent resin products.

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