Features
ME/SE Series features
High-speed
High-speed evaluation of full area wafers (up to 12 inch).
Using an unprecedented amount of data, you can provide feedback to your troubleshooting process and bring your quality control to a new level.
・Thickness measurement upgraded from “point” to full-fledged “surface” evaluation
・Whole surface evaluation provides great insights for process evaluation
Using an unprecedented amount of data, you can provide feedback to your troubleshooting process and bring your quality control to a new level.
・Thickness measurement upgraded from “point” to full-fledged “surface” evaluation
・Whole surface evaluation provides great insights for process evaluation
High-speed
ME/SE Series features
High-resolution
ME-210(-T)
In addition to its large surface measurement capabilities of wafers up to 12 inches, the ME-210(-T) provides a high-resolution mode, allowing zooming into areas as small as a few micrometers.
Measurement area size: up to 12 inches (standard: 8 inches)
Spot size:
Standard mode ： □ 0.55 mm
Intermediate mode： □ 55μm
High-resolution mode: □ 5.5μm
Measurement area size: up to 12 inches (standard: 8 inches)
Spot size:
Standard mode ： □ 0.55 mm
Intermediate mode： □ 55μm
High-resolution mode: □ 5.5μm
ME/SE Series features
Thin film of transparent substrate measurements available
With ME-210-T, we made possible the evaluation of objects that are usually too difficult to evaluate using standard ellipsometric techniques, such as organic thin films for OLED, etc.
non-uniformity evaluation of thin films over transparent substrates
ME/SE Series features
Simple & compact SE-101
This compact point measurement system provides high-accuracy and high-repeatability thin film measurements.
Its detachable head can be used as a separate module to integrate into your manufacturing infrastructure.
Its detachable head can be used as a separate module to integrate into your manufacturing infrastructure.
Head is detachable and can be integrated into our customer infrastructures
Lineup&Specifications
ME/SE Series features
Specifications
ME/SE Series
Customizations, such as integration in manufacturing line or modification to a specific sample material or shape are welcome.
| ME-210-T | ME-210 | SE-101 | |
|---|---|---|---|
| Measurement | |||
| Repeatability | Thickness: 0.1nm Refractive index: 0.001 ※ | Thickness: 0.1nm Refractive index: 0.001 ※ |
|
| Speed | Max. speed ≥ 900 points/min (in standard mode, 100mm square area) | Smallest sampling interval 0.05 sec. |
|
| ≥ 5,000 points/min (in high-resolution, 1mm square area) | - | ||
| Light source | Semiconductor Laser (wavelength: 636nm) | Semiconductor Laser (wavelength: 636nm) |
|
| Spot size | Standard mode: 0.5mm □ High-resolution mode: 5.5µm □ | Approx. 1mm □ | |
| Incident angle | 70° | 70° | 70° |
| Transparent substrate measurement | OK | NG | NG |
| Hardware | |||
| Sample stage size | Max. ８ inch (Φ300mm in option) | Max. 4 inch (manual XY stage in option stroke: ±20mm) |
|
| Dimensions (W x D x H) | 650 × 650 × 1744 mm | 650 × 650 × 1740mm | 250 × 175 × 218.3mm |
| Weight | Approx. 200kg | Approx. 200kg | Approx. 5kg |
| Miscellaneous | |||
| Interface | GigE（camera signal） | GigE（camera signal） | |
| Power supply | AC100～240V | AC100～240V | |
| Software | ME-View | SE-View | |
| Accessories | Desktop PC Monitor User manual Standard sample | Notebook PC User manual Standard sample |
|